※ Scope of application：
Wafers / Silicon chips / Ceramic substrate / Glass panel / High frequency ceramic film / Biometrics / Stainless steel

Model: HS-2323HIC-FA
Machine specification：
Printing area：200×200mm
Base size：3"～8"
Base thickness：0.3～1.5mm
Table size：300×300mm
Screen size：450×450～550×550mm
Feeder feeding capacity：25/pcs
Receiver receiving capacity：25/pcs
Machine repeat accuracy：±0.005mm
Centered positioning accuracy：±0.005mm
Using power：220v，1phase，50/60hz
Machine size：1700(L)×1600(W)×1700mm(H)
Weight：about800kg